JPH0397941U - - Google Patents
Info
- Publication number
- JPH0397941U JPH0397941U JP590390U JP590390U JPH0397941U JP H0397941 U JPH0397941 U JP H0397941U JP 590390 U JP590390 U JP 590390U JP 590390 U JP590390 U JP 590390U JP H0397941 U JPH0397941 U JP H0397941U
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- lead
- pin
- tip
- array package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP590390U JPH0397941U (en]) | 1990-01-24 | 1990-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP590390U JPH0397941U (en]) | 1990-01-24 | 1990-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397941U true JPH0397941U (en]) | 1991-10-09 |
Family
ID=31509590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP590390U Pending JPH0397941U (en]) | 1990-01-24 | 1990-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397941U (en]) |
-
1990
- 1990-01-24 JP JP590390U patent/JPH0397941U/ja active Pending
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